WELCOME TO
MEEE 2027
2027 5th International Conference on Mechatronics and Electrical Engineering (MEEE) will be held in Chengdu, China, during August 6–8, 2027.
MEEE 2027 is committed to establishing a high-caliber interdisciplinary forum that facilitates substantive exchanges and in-depth collaboration between academia and industry. The conference will present cutting-edge advancements in mechatronics, electrical engineering, and allied fields, while offering a critical examination of prevailing technical bottlenecks and real-world engineering challenges. Through these discussions, we aim to identify actionable strategies and innovative solutions that will propel sustained progress across the discipline.
The conference will bring together leading academic scientists, researchers, and emerging talents for in-depth exchanges on cutting-edge research and key technical challenges. A rich and diverse program awaits, featuring plenary and keynote speeches, invited sessions, technical parallel sessions, and poster presentations, offering participants a comprehensive perspective on the latest scientific breakthroughs and real-world applications.
The conference will take place in Chengdu, a major technological hub in western China that offers a fertile ground for academic exchange and industry collaboration. With its profound historical heritage and distinctive cultural charm, Chengdu promises attendees an unforgettable experience beyond the scientific program. We look forward to welcoming you to Chengdu in MEEE 2027!
2027年第五届机电一体化与电气工程国际会议（MEEE 2027）将于2027年8月6日至8日在中国·成都举行。本次会议由电子科技大学主办，上海大学协办。
MEEE 会议始终致力于构筑高水平的跨学科学术桥梁，推动学术界与工业界开展深度对话与协同创新。会议将集中呈现机电一体化、电气工程及交叉领域的最新研究成果，深入剖析当前技术瓶颈与工程实践中的现实难题，力求探寻行之有效的解决路径，为学科发展注入持续动力。
本届会议将汇聚全球顶尖的学术领军人物、科研工作者及青年学者，围绕前沿课题与关键核心技术展开深度交流与思想碰撞。会议日程精彩纷呈，设有主旨报告、特邀专题、技术平行分会及海报展示等多元环节，全方位展现最新科学突破与产业应用动态。
成都—中国西部的重要科技中心，为学术研讨与产业对接提供了优渥的土壤。这座千年古城深植着厚重的历史文脉，洋溢着独具一格的人文风情，定将为与会代表留下科研探索与城市体验交相辉映的美好记忆。热忱期待2027年与您在成都相聚，共襄学术盛会！
Conference proceedings 会议论文集
English is the official language of the conference. All papers must be written and presented in English. All submissions will undergo a double-blind peer-review process, evaluated on the basis of technical quality, relevance to the conference scope, originality, significance, and clarity.
Upon proper registration and successful presentation, accepted papers will be published in the MEEE 2027 Conference Proceedings.
会议官方语言为英语，所有论文必须使用英文撰写并进行报告。所有来稿将经过严格的同行评审，录用论文在完成注册并成功报告后，将收录于MEEE 2027 会议论文集中。
Submission Guideline 投稿指南
Template
1. Full Paper (Word): MEEE-Template.docx
2. Full Paper (Latex): Conference-LaTeX-template.zip
3. Abstract (Word): Abstract.doc
Electronic Submission System
Online Submission System (click)
If you have any enquiry, please feel free to contact us at:
meee-conf@outlook.com.
Important Dates
Submission Deadline: October 25, 2025
Acceptance Notification: November 10, 2025
Registration Deadline: November 15, 2025
Conference Date: December 3-5, 2025
Delegate Registration
Please email Payment Order ID &
Payment Email to conference secretary
and
wait for the secretary‘s confirmation.
Call for papers 征稿主题
The conference invites original, unpublished contributions in the broad areas of mechatronics and electrical engineering. Papers are solicited in, but not limited to, the following six tracks:
-
Track 1: Electromagnetics and Electrical Engineering Fundamentals
- Computational electromagnetics and field analysis
- Electromagnetic compatibility (EMC) and interference suppression
- High-voltage engineering and insulation technology
Track 2: Intelligent Mechatronics and Robotic Systems
- Intelligent mechatronic systems
- Advanced motion control and servo technologies
- Industrial, mobile, and humanoid robotics
Track 3: Power Systems, Power Electronics, and Electrical Drives
- Power system operation, stability, and resilience
- Smart grids and microgrid technologies
- Power electronic converters and control
Track 4: Renewable Energy, Energy Storage, and Electrification
- Renewable energy generation systems
- Battery management and energy storage technologies
- Energy management and optimization
Track 5: Automation, Digital Twins, and Intelligent Manufacturing
- Industrial automation and control systems
- SCADA and industrial communication technologies
- Digital twins and cyber-physical systems
Track 6: Intelligent Sensing, Condition Monitoring, and AI Applications
- Smart sensing and sensor fusion
- Computer vision and intelligent inspection
- Signal processing and fault diagnosis
